Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections
Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections
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| Genre | |
|---|---|
| Physical Description |
II, VII, 48, [75] sivu : kuvitettu ; 25 cm Julkaistu myös verkkoaineistona Julkaistu myös verkkoaineistona (ISBN 951-22-8464-2, 978-951-22-8464-1) |
| Language |
English |
| Language of Original Work |
English |
| Item Description |
Artikkeliväitöskirjan yhteenveto-osa ja 6 eripainosta. |
| Published |
Espoo :
Helsinki University of Technology,
2006
|
| Dissertation Note | Väitöskirja : Teknillinen korkeakoulu, Espoo |
| Series | Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology, ISSN 1457-0440; 15 |
| Classification | |
| Subjects | |
| Manufacturer | (Otamedia) |
| Additional Information | Hao Yu |
| ISBN |
978-951-22-8463-4 nidottu 951-22-8464-2 PDF 978-951-22-8464-1 PDF |
| Standard number |
TKK-DISS-2215 |
| Get full text | |