Tietueen sitaatit
APA-viiteYu, H. (2006). Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections. Helsinki University of Technology.
Chicago-tyylinen lähdeviittausYu, Hao. Combined Thermal, Thermodynamic and Kinetic Modelling for the Reliability of High-density Lead-free Solder Interconnections. Espoo: Helsinki University of Technology, 2006.
MLA-viiteYu, Hao. Combined Thermal, Thermodynamic and Kinetic Modelling for the Reliability of High-density Lead-free Solder Interconnections. Helsinki University of Technology, 2006.
Harvard-tyylinen lähdeviittausYu, H. 2006. Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections. Espoo: Helsinki University of Technology.