Haku

Tietueen sitaatit

APA-viite

Yu, H. (2006). Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections. Helsinki University of Technology.

Chicago-tyylinen lähdeviittaus

Yu, Hao. Combined Thermal, Thermodynamic and Kinetic Modelling for the Reliability of High-density Lead-free Solder Interconnections. Espoo: Helsinki University of Technology, 2006.

MLA-viite

Yu, Hao. Combined Thermal, Thermodynamic and Kinetic Modelling for the Reliability of High-density Lead-free Solder Interconnections. Helsinki University of Technology, 2006.

Harvard-tyylinen lähdeviittaus

Yu, H. 2006. Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections. Espoo: Helsinki University of Technology.

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