Materials for High-density Electronic Packaging and Interconnection

Materials for High-density Electronic Packaging and Interconnection

SFX

Hae kokoteksti

E-kirja

National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging

;

Commission on Engineering and Technical Systems

;

Committee on Materials for High-Density Electronic Packaging

;

Division on Engineering and Physical Sciences

;

National Materials Advisory Board

National Academies Press 1990

Tallennettuna:

Kieli

englanti

Julkaisija

National Academies Press, 1990

ISBN

0-309-04233-X
9786610212514
1-280-21251-9
0-309-53669-3
0-585-14395-1

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