Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions
Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions
Sparad:
| Genre | |
|---|---|
| Fysisk beskrivning |
Myös verkkoaineistona xiii, 128, [6] sivua : kuvitettu ; 25 cm |
| Språk |
engelska |
| Förlag |
Espoo :
Helsinki University of Technology,
2007.
|
| Lärdomsprov | Väitöskirja Espoo : Teknillinen korkeakoulu |
| Serie | Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology, ISSN 1457-0440; 17 |
| Klassifikation | |
| Mer information | Pekka Marjamäki |
| ISBN |
978-951-22-8734-5 nidottu 978-951-22-8735-2 PDF |
| Hämta fulltext | |