Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions
Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions
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| Genre | |
|---|---|
| Physical Description |
Myös verkkoaineistona xiii, 128, [6] sivua : kuvitettu ; 25 cm |
| Language |
English |
| Published |
Espoo :
Helsinki University of Technology,
2007.
|
| Dissertation Note | Väitöskirja Espoo : Teknillinen korkeakoulu |
| Series | Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology, ISSN 1457-0440; 17 |
| Classification | |
| Additional Information | Pekka Marjamäki |
| ISBN |
978-951-22-8734-5 nidottu 978-951-22-8735-2 PDF |
| Get full text | |