TY  - GEN
TY  - GEN
T1  - Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections
T2  - Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology
A1  - Yu, Hao
LA  - eng
PP  - Espoo
PB  - Helsinki University of Technology
YR  - 2006
UL  - https://kansalliskirjasto.finna.fi/Record/vaari.1584874
NO  - Artikkeliväitöskirjan yhteenveto-osa ja 6 eripainosta.
SN  - 978-951-22-8463-4 nidottu
SN  - 951-22-8464-2 PDF
SN  - 978-951-22-8464-1 PDF
KW  - reliability
KW  - solder interconnection
KW  - thermal modelling
KW  - thermodynamic calculation
KW  - kinetics
KW  - interfacial reaction
ER  -