TY  - GEN
TY  - GEN
T1  - Lead-free Solder Interconnect Reliability
A1  - Dongkai Shangguan (ed)
A2  - Shangguan, Dongkai
LA  - eng
PB  - ASM International
YR  - 2005
UL  - https://kansalliskirjasto.finna.fi/Record/nelli06.2560000000049842
SN  - 0-87170-816-7
SN  - 1-61503-093-X
KW  - Material Science and Metallurgy : General and Others
ER  -