TY  - GEN
TY  - GEN
T1  - Interfacial adhesion in metal/polymer systems for electronics
T2  - Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology
A1  - Ge, Jun
LA  - eng
PP  - Espoo
PB  - Helsinki University of Technology
YR  - 2003
UL  - https://kansalliskirjasto.finna.fi/Record/fikka.3990081
NO  - Artikkeliväitöskirjan yhteenveto-osa ja 5 eripainosta.
SN  - 951-22-6783-7 nidottu
ER  -